Probe head receiver and probe card assembly having the same

ABSTRACT

The present disclosure relates to a probe head receiver, which includes: a first template, a guide plate and a spacer. The first template has a number of apertures of a first size. The guide plate has a number of apertures of a second size, each of the number of apertures of the first template is aligned with each of the number of apertures of the guide plate. The spacer is between the first template and the guide place. The second size is different from the first size.

BACKGROUND

Quality verification of an integrated circuit is required in variousstages of manufacture. A probe card assembly, which has a number ofprobe pins, may be used to perform quality verification on theintegrated circuit. Probe pins of the probe card assembly may contactconductive pads or metal bumps on a surface of a wafer or chip totransfer electrical signals.

Pitches of the conductive pads or metal bumps are reduced to fulfillscale-down requirement of the integrated circuit. For example, size ofeach of conductive pads on a wafer or chip to be test may be reduced toapproximately 40 micrometer (m), which implies each of the probe pinsmay have a maximum size of approximately 40 μm. Accordingly, each ofapertures of a probe head receiver may have a maximum size of 60 μm tomake sure each of the probe pins may pass each aperture. Moreover,distance where each probe pin travels during assembling is relativelygreater than the size of each aperture.

It may take at least 35 labor days to manually assemble a probe cardassembly having 25,000 probe pins, where each probe pin is manuallyinserted into each aperture of a probe head receiver. Automaticinsertion of probe pins into apertures of a probe head receiver mayreduce manufacturing time of the probe card assembly, however,misalignment of even one probe pin to a corresponding aperture mayresult in failure of the probe card assembly.

BRIEF DESCRIPTION OF THE DRAWINGS

Aspects of the present disclosure are best understood from the followingdetailed description when read with the accompanying figures. It isnoted that, in accordance with the standard practice in the industry,various features are not drawn to scale. In fact, the dimensions of thevarious features may be arbitrarily increased or reduced for clarity ofdiscussion.

FIG. 1 illustrates a probe head receiver in accordance with someembodiments of the present disclosure.

FIG. 2 illustrates a guide plate in accordance with some embodiments ofthe present disclosure.

FIG. 3 illustrates another probe head receiver in accordance with someembodiments of the present disclosure.

FIG. 4 illustrates another probe head receiver in accordance with someembodiments of the present disclosure.

FIG. 5 illustrates a space transformer in accordance with someembodiments of the present disclosure.

FIG. 5A illustrates a probe pin in accordance with some embodiments ofthe present disclosure.

FIG. 5B illustrates another probe pin in accordance with someembodiments of the present disclosure.

FIG. 5C illustrates another probe pin in accordance with someembodiments of the present disclosure.

FIG. 6 illustrates an operation of assembling a probe head receiver anda space transformer in accordance with some embodiments of the presentdisclosure.

FIG. 7 illustrates another operation of assembling a probe head receiverand a space transformer in accordance with some embodiments of thepresent disclosure.

FIG. 8 illustrates a probe card assembly in accordance with someembodiments of the present disclosure.

FIG. 9 illustrates another operation of assembling a probe head receiverand a space transformer in accordance with some embodiments of thepresent disclosure.

DETAILED DESCRIPTION

The following disclosure provides many different embodiments, orexamples, for implementing different features of the provided subjectmatter. Specific examples of components and arrangements are describedbelow to simplify the present disclosure. These are, of course, merelyexamples and are not intended to be limiting. For example, the formationof a first feature over or on a second feature in the description thatfollows may include embodiments in which the first and second featuresare formed in direct contact, and may also include embodiments in whichadditional features may be formed between the first and second features,such that the first and second features may not be in direct contact. Inaddition, the present disclosure may repeat reference numerals and/orletters in the various examples. This repetition is for the purpose ofsimplicity and clarity and does not in itself dictate a relationshipbetween the various embodiments and/or configurations discussed.

Further, spatially relative terms, such as “beneath,” “below,” “lower,”“above,” “upper” and the like, may be used herein for ease ofdescription to describe one element or feature's relationship to anotherelement(s) or feature(s) as illustrated in the figures. The spatiallyrelative terms are intended to encompass different orientations of thedevice in use or operation in addition to the orientation depicted inthe figures. The apparatus may be otherwise oriented (rotated 90 degreesor at other orientations) and the spatially relative descriptors usedherein may likewise be interpreted accordingly.

It would be desired to have a probe card assembly of relatively lessmanufacturing time.

FIG. 1 illustrates a probe head receiver in accordance with someembodiments of the present disclosure.

Referring to FIG. 1, a probe head receiver 10 may include a template101, a connection element 102, a template 103, a spacer 104, a guideplate 105, a connection element 106, a template 107, connection element108 and a template 109.

The templates 101, 103, 107 and 109, the guide plate 105 and the spacer104 may have a variety of shapes and dimensions, depending upon a designof request. For example, the templates 101, 103, 107 and 109, the guideplate 105 and the spacer 104 may be rectangular or circular in shape, ormay have irregular shapes.

An example range of thickness for each of the templates 101, 103, 107and 109 is about 250 micrometers (μm) to about 675 μm, where the termthickness as related to the templates 101, 103, 107 and 109 indicates avertical dimension in the context of FIG. 1. The thickness of each ofthe templates 101, 103, 107 and 109 is about 500 μm.

The templates 101 and 103 are disposed on the spacer 104. The templates101 and 103 are secured by connection elements 102. The connectionelements 102 may include, for example, pins, clamps, or the like. Thetemplate 101 and the spacer 104 may be secured by other connectionelements (not shown in FIG. 1) similar or the same to the connectionelements 102.

Template 101 includes a number of apertures 51. The apertures 51 may bea number of through holes formed in the template 101. The apertures 51may be rectangular or circular in shape but may be varied in accordancewith some other embodiments of the present disclosure. An example rangeof size or width of the apertures 51 is about 50 ƒm to about 70 μm,where the term size or width as related to the apertures 51 indicates ahorizontal dimension in the context of FIG. 1. The size or width of theapertures 51 is about 60 μm. The size or width of the apertures 51 isabout 55 μm. Each of the apertures 51 of the template 101 has a width W3on a top surface (not denoted in FIG. 1) of the template 101 and a widthW4 on a bottom surface (not denoted in FIG. 1) of the template 101,wherein the width W3 is substantially the same as the width W4.

The template 103 includes a number of apertures 53. The apertures 53 maybe a number of through holes formed in the template 103. The number ofthe apertures 51 may be the same with the number of the apertures 53.Each of the number of apertures 51 is aligned with each of the number ofapertures 53. The apertures 53 are aligned to respective apertures 51.The apertures 53 may have a shape and a size similar or the same tothose of the apertures 51.

Example materials for the templates 101 and 103 may include, withoutlimitation, silicon, silicon nitride, plastic and quartz.

The spacer 104 is disposed between the template 101 and the guide plate105. Example materials for the spacer 104 may include, withoutlimitation, metals, such as steel, or other rigid materials that havegood flatness and provide stability for the template 101 and the guideplate 105. An example range of thickness for the spacer 104 is about 3millimeters (mm) to about 5 mm. The thickness of the spacer 104 is about4 mm.

The guide plate 105 is disposed under the spacer 104. The guide plate105 and the spacer 104 may be secured by connection elements (not shownin FIG. 1) similar to the connection elements 102. An example range ofthickness for the guide plate 105 is about 250 μm to about 675 μm. Thethickness of the guide plate 105 is about 500 μm. Example materials forthe guide plate 105 may include, without limitation, ceramic, FR4,polyimide or the like.

The guide plate 105 includes a number of apertures 55. The apertures 55may be a number of through holes formed in the guide plate 105. Thenumber of the apertures 55 may be the same with the number of theapertures 51. Each of the number of apertures 55 is aligned with each ofthe number of apertures 51. The apertures 55 are aligned to respectiveapertures 51. The apertures 55 may have a shape different from that ofthe apertures 51 and 53. Apertures 55 may have a size different fromthat of the apertures 51 and 53. Details of the guide plate 105 mayfurther be described with reference to FIG. 2 below.

FIG. 2 illustrates a guide plate in accordance with some embodiments ofthe present disclosure.

Referring to FIG. 2, which shows an enlarged view of the guide plate105. Each of the apertures 55 formed in the guide plate 105 may be afunnel in shape. Each of the apertures 55 extends from a top surface(not denoted in FIG. 2) to a bottom surface (not denoted in FIG. 2) ofthe guide plate 105. Each of the apertures 55 may have a size or a widthwhich tapers downward. Each of the apertures 55 has a width W1 on thetop surface (not denoted in FIG. 2) of the guide plate 105 and a widthW2 on the bottom surface (not denoted in FIG. 2) of the guide plate 105,wherein the width W1 is greater than the width W2. The width W2 as shownin FIG. 2 is substantially the same as the width W3 as shown in FIG. 1.Each of the apertures 55 is defined by a sidewall 55 s. Size of each ofthe apertures 55 is greater than that of each of the apertures 51. Thewidth W1 is greater than the width W2 by approximately 13 to 14 μm. Thewidth W1 is greater than the width W2 by approximately 15 μm.

Referring back to FIG. 1, the template 107 is disposed under the guideplate 105. The template 107 and the guide plate 105 are secured by theconnection elements 106, which may be similar or the same to theconnection elements 102. The template 107 includes a number of apertures57. The apertures 57 may be a number of through holes formed in thetemplate 107. The number of the apertures 57 may be the same with thenumber of the apertures 55. Each of the number of apertures 57 isaligned with each of the number of apertures 55. The apertures 57 arealigned to respective apertures 55. The apertures 57 may have a shapeand a size similar or the same to those of the apertures 51. Thetemplate 107 may include materials similar or the same to those of thetemplate 101.

The template 109 is disposed under the template 107. The template 109and the template 107 are secured by connection elements 108, which maybe similar or the same to the connection elements 102. The template 109includes a number of apertures 59. The apertures 59 may be a number ofthrough holes formed in the template 109. The number of the apertures 59may be the same with the number of the apertures 57. Each of the numberof apertures 59 is aligned with each of the number of apertures 57. Theapertures 59 are aligned to respective apertures 57. The apertures 59may have a shape and a size similar or the same to those of theapertures 51. The template 109 may include materials similar or the sameto those of the template 101.

FIG. 3 illustrates another probe head receiver in accordance with someembodiments of the present disclosure.

Referring to FIG. 3, probe head receiver 11 may be similar to the probehead receiver 10 as described and illustrated with reference to FIG. 1,except that the guide plate 105 and the template 101 are swapped orexchanged. The guide plate 105 is disposed over the spacer 104. Thetemplate 103 is disposed over the guide plate 105. The guide plate 105is disposed between the template 103 and the spacer 104.

FIG. 4 illustrates another probe head receiver in accordance with someembodiments of the present disclosure.

Referring to FIG. 4, probe head receiver 12 is similar to the probe headreceiver 10 as described and illustrated with reference to FIG. 1,except that the guide plate 105 is replaced by a template 101′. Thetemplate 101′ may have a structure similar or the same to the template101.

FIG. 5 illustrates a space transformer in accordance with someembodiments of the present disclosure.

Referring to FIG. 5, a space transformer 20 may include a spacetransformer plate 120, a printed circuit board (PCB) 140, fixing rings110 and probe pins 130.

The space transformer plate 120 may include, for example but is notlimited to, a substrate 120. The substrate 120 includes contact pads121. The substrate 120 is bonded to the PCB 140 through flip-chipbonding, with solder balls 122 therebetween. It is contemplated that thespace transformer plate 120 may include other types of carriers (notshown in FIG. 5), which may be attached to the PCB 140 by adhesive andthe contact pads 121 may be electrically connected to the PCB 140 bywires. Metal lines and vias (not shown in FIG. 5) are formed in thesubstrate 120, so that the solder balls 122 may have greater pitchesthan the contact pads 121 on the substrate 120.

The contact pads 121 are configured to have the same pitch as the probepins 130, so that they can physically contact probe pins 130 when theprobe pins 130 are in contact with the contact pads of the device undertest (DUT, not shown), the contact pads of the DUT have an electricalconnection to the solder balls 122, which connect the PCB 140 to thespace transformer plate 120. The DUT may include integrated circuitsformed on a wafer. The contact pads 121 may include, for example,aluminum (Al), copper (Cu), gold (Au) or a mixture, an alloy, or othercombination thereof.

Fixing rings 110 are secured on the PCB 140. Each or the fixing rings110 has opening(s) 111.

The probe pins 130 are configured to have the same pitch as apertures51, 53, 55, 57 and 59 as described and illustrated with reference toFIG. 1. An example range of size or width of the probe pins 130 is about35 μm to about 45 μm where the term size or width as related to theprobe pins 130 indicates a horizontal dimension in the context of FIG.5. The size or width of the probe pins 130 is about 40 μm. An examplerange of the pitch of the probe pins 130 is about 35 μm to about 45 μm.The pitch of the probe pins 130 is about 40 μm. The probe pins 130 mayinclude, for example, but is not limited to 27,000 pins formed in amatrix. The probe pins 130 are formed of conductive materials such asmetals.

FIG. 5A illustrates a probe pin in accordance with some embodiments ofthe present disclosure.

Referring to FIG. 5A, the probe pin 130 a is attached with one probe pinstopper 132, which has lateral size W5 greater than lateral size W6 ofthe respective probe pin 130 a. The probe pin stopper 132 may be coatedon the probe pin 130 a, and may be formed of a conductive or adielectric material.

FIG. 5B illustrates another probe pin in accordance with someembodiments of the present disclosure.

Referring to FIG. 5B, probe pin stopper 132 is a compressed portion ofprobe pin 130 b, and hence is formed of a same material as probe pin 130b. In FIGS. 5A and 5B, the probe pins 130 a and 130 b may have circularcross-sectional views.

FIG. 5C illustrates another probe pin in accordance with someembodiments of the present disclosure.

Referring to FIG. 5C, probe pin 130 c may have a rectangular (such as asquare) cross-sectional view (a top view or a bottom view), and probepin stopper 132 may be plated on the probe pin 130 c. In an embodiment,an entirety (except the portion on which probe pin stopper 132 is formedor attached) of one probe pin 130 c has a uniform lateral dimension W6and a uniform cross-sectional shape. In accordance with some otherembodiments, different portions of the probe pin 130 c may havedifferent lateral dimensions.

FIG. 6 illustrates an operation of assembling a probe head receiver anda space transformer in accordance with some embodiments of the presentdisclosure.

Referring to FIG. 6, the probe pins 130 are to be inserted the probehead receiver 10. Each the probe pins 130 has to in turn pass theapertures 53, 51, 55, 57 and 59 such that the probe pin stopper 132 (notshown in FIG. 6) formed on each the probe pins 130 may support the probepins 130 on a top surface (not denoted in FIG. 6) of the template 103.Each the probe pins 130 has to in turn pass the apertures 53, 51, 55, 57and 59 such that the openings 111 formed in the fixing rings 110 mayreceive secure pins 41 to secure the probe head 10 structure to thefixing rings 110.

FIG. 8 illustrates a probe card assembly in accordance with someembodiments of the present disclosure.

Referring to FIG. 8, a probe card assembly 1 may include the probe headreceiver 10 and the space transformer 20. Once the probe pins 130 areprecisely pass the apertures 53, 51, 55, 57 and 59 as shown in FIG. 6,which implies that the probe pins 130 are well aligned to the respectiveapertures 53, 51, 55, 57 and 59, the probe pin stopper 132 formed oneach the probe pins 130 may support each the probe pin 130 on the topsurface (not denoted in FIG. 8) of the template 103. The secure pins 41,which may pass through holes formed in the spacer 104, may be receivedby the openings 111 formed in the fixing rings 110 to secure the probehead receiver 10 to the space transformer 20 to form the probe cardassembly 1.

The probe card assembly 1 includes a template 101, a connection element102, a template 103, a spacer 104, a guide plate 105, a connectionelement 106, a template 107, connection element 108, a template 109, aspace transformer plate 120, a printed circuit board (PCB) 140, fixingrings 110 and probe pins 130. The PCB 140 provides electricalconnections to test equipment and the space transformer plate 120provide electrical connections between the PCB 140 and the probe headreceiver 10, which may be smaller than the space transformer 20. Spacetransformer plate 120 may be made as a single layer of material or frommultiple layers. For example, the space transformer plate 120 may be amulti-layer ceramic (MLC). In accordance with some other embodiments ofthe present disclosure, the space transformer plate 120 may be aMulti-Layer Silicon (MLS) space transformer plate 120 made using siliconwafer fabrication techniques. An MLS space transformer plate 120 mayprovide finer contact pitch, as compared to an MLC space transformerplate 120.

The probe head receiver 10 supports a plurality of the probe pins 130that make contact with a device under test (not shown in FIG. 8). Theprobe pins 130 extend through the apertures 55 in the guide plate 105and through the apertures 53, 51, 57 and 59 in the templates 103, 101,107 and 109 and make contact with the contact pads 121 on the spacetransformer plate 120 when the probe pins 130 are in contact with thecontact pads of the DUT (not shown in FIG. 8). Examples of contact pads121 include, without limitation, pads and stud bumps.

The templates 103, 101, 107 and 109 and the guide plate 105 position andalign the probe pins 130 to match a pattern of desired contact pads on adevice under test. The spacer 104 provide a desired spacing between thetemplate 101 and the guide plate 105 and may also be used to attach theprobe head receiver 10 to the space transformer 20. The template 103 maybe attached directly to the space transformer 20, e.g., by bonding, ormay be spaced apart from the space transformer 20 as depicted in FIG. 8,depending upon a particular implementation. Other structures, e.g., afastener structure, may be used to hold probe head receiver 106 inposition with respect to space transformer 20 that are not depicted inFIG. 8 for purposes of explanation.

According to some embodiments of the present disclosure, the template103, 101, 107 and 109 and/or the guide plate 105 are made from a rigidmaterial to provide adequate alignment and thermal stability of theprobe pins, to ensure proper contact with a device under test. One ormore portions or the entirety of t the template 103, 101, 107 and 109and/or the guide plate 105 may be coated, for example, with anon-conductive material. Example non-conductive materials include,without limitation, insulating coating materials such as silicon dioxide(SiO2), rubber and other non-conductive materials. The use ofnon-conductive material in the apertures 53, 51, 57, 59 and 55 of thetemplate 103, 101, 107 and 109 and the guide plate 105 prevents shortsbetween the probe pins 130 if the guide plate material is notsufficiently insulating.

FIG. 7 illustrates another operation of assembling a probe head receiverand a space transformer in accordance with some embodiments of thepresent disclosure.

Referring to FIG. 7, which illustrates another operation of assemblingthe probe head receiver 10 and the space transformer 20 under acondition that any of the probe pins 130 is misaligned to any of theapertures 53, 51. If the probe pins 130 are deflected or misalignedduring an insertion operation, the probe pins 130 may still pass theapertures 53 and 51 due to a relatively short distance therebetween,however, while the probe pins 130 keep traveling in a deflecteddirection in a relatively long spacing of the spacer 104, the probe pins130 may not pass the apertures 55 of the guide plate 105 and may contactthe side walls 55 s of the apertures 55.

The side walls 55 s of the apertures 55 are capable of directing theprobe pins 130 from the deflected direction to another direction (e.g.the direction “Y” shown in dotted line in FIG. 7) different from thedeflected direction, such that the probe pins 130 may goes back to passthrough the apertures 55, 57 and 59 to perform the assembly operation toform the probe card assembly 1 as shown in FIG. 8. Thanks to the designof the guide plate 105, to auto insert a number of 27,000 probe pins tothe probe head receiver 10 may take approximately 8 labor days.

FIG. 9 illustrates another operation of assembling a probe head receiverand a space transformer in accordance with some embodiments of thepresent disclosure.

Referring to FIG. 9, which illustrates another operation of assemblingthe probe head receiver 12 (as shown in FIG. 4) and the spacetransformer 20 under a condition that any of the probe pins 130 ismisaligned to any of the apertures 53, 51. If the probe pins 130 aredeflected or misaligned during an insertion operation, the probe pins130 may still pass the apertures 53 and 51 due to a relatively shortdistance therebetween, however, while the probe pins 130 keep travelingin a deflected direction in a relatively long spacing of the spacer 104,the probe pins 130 may not pass the apertures 51′ of the template 101′and may contact the top surface (not denoted in FIG. 9) of the template101′. The top surface (not denoted in FIG. 9) of the template 101′ maynot function to direct the probe pins 130 back to pass the apertures 51′but may rather damage the probe pins 130.

A force detector may be disposed on an auto pin-installer to insert theprobe pins 130 to the probe head receivers 10, 11 and 12 as shown inFIGS. 1, 3 and 4. The force detector may detect whether a force, e.g. adownward force, exceeds a predetermined value or a threshold, forexample, 5 g. If the force detected is greater than the threshold, theauto pin-installer may stop the insertion operation and lift the probepins 130 to avoid damage.

In accordance with some embodiments of the present disclosure, a probehead receiver includes: a first template, a guide plate and a spacer.The first template has a number of apertures of a first size. The guideplate has a number of apertures of a second size, each of the number ofapertures of the first template is aligned with each of the number ofapertures of the guide plate. The spacer is between the first templateand the guide place. The second size is different from the first size.

In accordance with some embodiments of the present disclosure, a probehead receiver includes: a guide plate, a first template and a spacer.The guide plate has a number of sidewalls to direct an object from afirst direction to a second direction different from the firstdirection. Each of the number of sidewalls defines an aperture. Thefirst template has a number of apertures. Each of the number ofapertures of the first template is aligned with each of the number ofapertures of the guide plate. The spacer is between the first templateand the guide place.

In accordance with some embodiments of the present disclosure, a probecard assembly includes a probe head receiver and a number of probe pins.The probe head receiver includes a first template, a guide plate and aspacer. The first template has a number of apertures. The guide platehas a top surface and a bottom surface and a number of funnel-shapeapertures formed therein. The funnel-shape apertures extend from the topsurface to the bottom surface of the guide plate. The spacer is betweenthe first template and the guide place. Each the number of probe pinspasses through each of the number of apertures of the first template andthrough each of the number of funnel-shape apertures.

The foregoing outlines features of several embodiments so that thoseskilled in the art may better understand the aspects of the presentdisclosure. Those skilled in the art should appreciate that they mayreadily use the present disclosure as a basis for designing or modifyingother processes and structures for carrying out the same purposes and/orachieving the same advantages of the embodiments introduced herein.Those skilled in the art should also realize that such equivalentconstructions do not depart from the spirit and scope of the presentdisclosure, and that they may make various changes, substitutions, andalterations herein without departing from the spirit and scope of thepresent disclosure.

What is claimed is:
 1. A probe head receiver, comprising: a firsttemplate having a number of apertures of a first size; a guide platehaving a number of apertures of a second size, each of the number ofapertures of the first template being aligned with each of the number ofapertures of the guide plate; and a spacer between the first templateand the guide place, wherein the second size is different from the firstsize.
 2. The probe head receiver of claim 1, wherein the second size isgreater than the first size.
 3. The probe head receiver of claim 1,wherein the guide plate is under the spacer.
 4. The probe head receiverof claim 3, further comprising a second template under the guide plate.5. The probe head receiver of claim 1, wherein the guide plate is overthe spacer.
 6. The probe head receiver of claim 5, further comprising asecond template over the guide plate.
 7. The probe head receiver ofclaim 1, wherein a width of each of the number of apertures of the guideplate is tapering downward.
 8. The probe head receiver of claim 1,wherein each of the number of apertures of the guide plate has a firstwidth on a top surface of the guide plate and a second width on a bottomsurface of guide plate, wherein the first width is greater than thesecond width.
 9. The probe head receiver of claim 8, wherein each of thenumber of apertures of the first template has a third width on a topsurface of the first template and a fourth width on a bottom surface offirst template, wherein the third width is substantially the same as thefourth width, and the second width is substantially the same as thethird width.
 10. The probe head receiver of claim 8, wherein the firstwidth is greater than the second width by approximately 15 micrometers.11. The probe head receiver of claim 1, wherein the guide platecomprises one of ceramic, FR4 or polyimide.
 12. A probe head receiver,comprising: a guide plate having a number of sidewalls to direct anobject from a first direction to a second direction different from thefirst direction, each of the number of sidewalls defining an aperture; afirst template having a number of apertures, each of the number ofapertures of the first template being aligned with each of the number ofapertures of the guide plate; a spacer between the first template andthe guide place.
 13. The probe head receiver of claim 12, wherein theguide plate is under the spacer.
 14. The probe head receiver of claim13, further comprising a second template under the guide plate.
 15. Theprobe head receiver of claim 12, wherein the guide plate is over thespacer.
 16. The probe head receiver of claim 15, further comprising asecond template over the guide plate.
 17. The probe head receiver ofclaim 12, wherein the guide plate comprises one of ceramic, FR4 orpolyimide.
 18. A probe card assembly, comprising: a probe head receivercomprising: a first template having a number of apertures; a guide platehaving a top surface and a bottom surface and a number of funnel-shapeapertures formed therein and extending from the top surface to thebottom surface; and a spacer between the first template and the guideplace, and a number of probe pins, each the number of probe pins passingthrough each of the number of apertures of the first template andthrough each of the number of funnel-shape apertures.
 19. The probe cardassembly of claim 18, wherein each of the number of funnel-shapeapertures has a first width on the top surface of the guide plate and asecond width on the bottom surface of the guide plate, wherein the firstwidth is different from the second width.
 20. The probe card assembly ofclaim 18, wherein the first width is greater than the second width.